Mobile Handsets

Why TriQuint?

TriQuint alone has the in-house manufacturing expertise, product building blocks, and comprehensive process technology to offer both active and passive elements in our solutions. Our highly integrated modules offer customers an RF system-in-a-chip solution, reducing engineering complexity and delivering compelling value.

Technology
With the industry’s broadest in-house technology portfolio, TriQuint is uniquely positioned to deliver synergies through our GaAs, SAW and BAW capabilities.

• Since these are in-house technologies, TriQuint’s engineering teams efficiently produce devices matched to transceiver and baseband components. This reduces system design time and speeds manufacturing, while enhancing performance and overall reliability.
• Brilliant minds design the industry’s smallest PAs.
• Advances in CuFlip™ Copper Bump technology enables higher yields, and superior thermal and electrical performance.
• No other vendor has TriQuint’s breadth of technology or ability to reduce the BOM, increase performance and add value while delivering high volume.

Innovation
Highly integrated modules offer a smaller footprint and reduced engineering complexity, which can lead to shorter time to market and lower design costs for our customers.

Experience
Strong GaAs heritage, quality products, security of supply, and a diversified business portfolio offer peace of mind. TriQuint is a leading high volume supplier to the industry’s top handset manufacturers, across all key air interfaces and global markets.

Why Modules?

Highly integrated modules offer numerous benefits when compared to the use of discrete filter, duplexer, switch and PA components.

Smaller Size: Our smaller footprint leaves more board space for rich features such as cameras, GPS, MP3 player, or FM radio.

Reduced Bill of Materials: Modules lower your inventory and unify sourcing while cutting assembly cost and reducing pick-and-place.

Extended battery life: Electrical interfaces are optimized between components to decrease mismatches thereby improving battery consumption.

Plug & Play Interoperability: Aligned, tested and pre-qualified with industry leading chipsets and single chip solution providers means less testing and faster time to market.

Which Family?

HADRON PA Module™ is a family of discrete PA modules for GSM/GPRS/EDGE-Linear or GSM/GPRS/EDGE-Polar applications, each aligned with industry leading tranceiver chipset vendors.

QUANTUM Tx Module™ is a family of highly-integrated modules for Dual-Band and Quad-Band, GSM/GPRS (2G) and GSM/GPRS/EDGE (2.5G) applications, each aligned with industry leading tranceiver chipset vendors.

TRITIUM PA-Duplexer Module™ is a family of highly-integrated modules for WCDMA/HSDPA and CDMA applications, each aligned with industry leading tranceiver chipset vendors.